新闻中心

EEPW首页 > 测试测量 > 业界动态 > 通富微电测试技术

通富微电测试技术

作者: 时间:2022-04-18 来源:通富微电 收藏

20200907092541_87497.jpg 

本文引用地址://www.cazqn.com/article/202204/433191.htm

Production Overview

        TFME offers various WBBGA and WBLGA package based on customer different requirement.




Features
- 1.1x0.7 mm to 21x21 mm Package
- 0.2mm to 1.0mm C Mold Chase
- 01005 Components SMT
- 0.3x0.3 mm Small Die 
- 1-6 Layer Substrate


Process Capability & Design Rule


Reliability Test Standards



Shipment Packing









关键词: 封装 测试 通富微电

评论


相关推荐

技术专区

关闭